CEI EN 62047-18 : 2014
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
Hardcopy , PDF
English
01-01-2014
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method
6 Test report
Annex A (informative) - Precautions for the test piece
substrate interface
Annex B (informative) - Precautions necessary for the
force displacement relationship
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Describes the method for bend testing of thin film materials with a length and width under 1 mm and a thickness in the range between 0,1 [mu]m and 10 [mu]m.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-115. (05/2014)
|
| DocumentType |
Standard
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 62047-18:2013 | Identical |
| IEC 62047-18:2013 | Identical |
| EN 62047-6:2010 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
| IEC 62047-6:2009 | Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials |
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