CEI EN 62047-18 : 2014
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 18: BEND TESTING METHODS OF THIN FILM MATERIALS
Hardcopy , PDF
English
01-01-2014
FOREWORD
1 Scope
2 Normative references
3 Symbols and designations
4 Test piece
5 Testing method
6 Test report
Annex A (informative) - Precautions for the test piece
substrate interface
Annex B (informative) - Precautions necessary for the
force displacement relationship
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
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