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SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-01-2012
Publisher: Comitato Elettrotecnico Italiano
FOREWORD1 Scope2 Terms and definitions3 Test equipment4 Test samples 5 Procedures6 Lifetime estimation7 Lifetime dependence on inter-metal layer area 8 SummaryAnnex A (informative) - Engineering supplementation for lifetime estimationBibliography
Defines a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.
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