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  • EN 62374-1:2010/AC:2011

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - PART 1: TIME-DEPENDENT DIELECTRIC BREAKDOWN (TDDB) TEST FOR INTER-METAL LAYERS

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    Published date:  01-04-2011

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 Scope
    2 Terms and definitions
    3 Test equipment
    4 Test samples
    5 Procedures
    6 Lifetime estimation
    7 Lifetime dependence on inter-metal layer area
    8 Summary
    Annex A (informative) - Engineering supplementation for
            lifetime estimation
    Bibliography

    Abstract - (Show below) - (Hide below)

    Specifies a test method, test structure and lifetime estimation method of the time-dependent dielectric breakdown (TDDB) test for inter-metal layers applied in semiconductor devices.

    General Product Information - (Show below) - (Hide below)

    Committee SR 47
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current
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