CEI EN 62435-1 : 1ED 2017
Current
The latest, up-to-date edition.
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL
10-10-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms definitions and abbreviated terms
4 Purpose of long-term storage
5 Logistics
6 Storage considerations for devices after card (or other)
attachment
7 Handling
8 Inspection
9 Inventory control process
10 Transportation
11 Lead finishes
12 Kitting and lot control
13 Validation
14 Unplanned storage and types of storage
15 Other things to store in addition to the components
16 Storage facility
17 Policies
18 Legislation and environmental issues
Annex A (informative) - Example checklist for project
managers
Annex B (normative) - Example checklist for long-term
storage facilities
Annex C (informative) - Example of a component list
Annex D (informative) - Examples of periodic and/or
de-stocking tests
Annex E (informative) - Parameters influencing the
quantity of components to be stored
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Contains the terms, definitions and principles of long-term-storage that can be used in as an obsolescence mitigation strategy.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-141. (10/2017)
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 62435-1:2017 | Identical |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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