I.S. EN 60749-37:2008
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
EN 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
EN 62435-1:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General |
I.S. EN 62435-2:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
I.S. EN 62435-5:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 5: DIE AND WAFER DEVICES |
09/30190356 DC : 0
|
BS EN 60749-40 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 40: BOARD LEVEL DROP TEST METHOD USING A STRAIN GAUGE |
NF EN 60749-37 : 2008
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
IEC 62435-4:2018
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage |
05/30135664 DC : DRAFT JUN 2005
|
IEC 60749-37 ED. 1 - SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD FOR HANDHELD ELECTRONIC PRODUCTS |
CEI EN 60749-37 : 2008
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |
IEC 61760-4:2015
|
Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices |
EN 61760-4:2015/A1:2018
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES (IEC 61760-4:2015/A1:2018) |
IEC 62137-4:2014
|
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices |
BS EN 62435-2:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Deterioration mechanisms |
BS EN 62137-4:2014
|
Electronics assembly technology Endurance test methods for solder joint of area array type package surface mount devices |
I.S. EN 62435-1:2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
BS EN 62435-1:2017
|
Electronic components. Long-term storage of electronic semiconductor devices General |
BS EN 61760-4 : 2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
CEI EN 62435-2 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS |
IEC TS 62686-1:2015
|
Process management for avionics - Electronic components for aerospace, defence and high performance (ADHP) applications - Part 1: General requirements for high reliability integrated circuits and discrete semiconductors |
CEI EN 62435-1 : 1ED 2017
|
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL |
IEC 62435-5:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 5: Die and wafer devices |
IEC 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
IEC 60749-37:2008
|
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
BS EN 62435-5:2017
|
Electronic components. Long-term storage of electronic semiconductor devices Die and wafer devices |
PD IEC/TS 62686-1:2015
|
Process management for avionics. Electronic components for aerospace, defence and high performance (ADHP) applications General requirements for high reliability integrated circuits and discrete semiconductors |
12/30271778 DC : 0
|
BS EN 62137-4 ED.1 - ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
I.S. EN 62137-4:2014
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES |
BS EN 60749-37:2008
|
Semiconductor devices. Mechanical and climatic test methods Board level drop test method using an accelerometer |
I.S. EN 61760-4:2015
|
SURFACE MOUNTING TECHNOLOGY - PART 4: CLASSIFICATION, PACKAGING, LABELLING AND HANDLING OF MOISTURE SENSITIVE DEVICES |
EN 60749-37:2008
|
Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer |
EN 62137-4:2014/AC:2015
|
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES (IEC 62137-4:2014) |
EN 62435-2:2017
|
Electronic components - Long-term storage of electronic semiconductor devices - Part 2: Deterioration mechanisms |
OVE/ONORM EN 60749-37 : 2008
|
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER |