• CEI EN 62435-1 : 1ED 2017

    Current The latest, up-to-date edition.

    ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 1: GENERAL

    Available format(s): 

    Language(s): 

    Published date:  10-10-2017

    Publisher:  Comitato Elettrotecnico Italiano

    Sorry this product is not available in your region.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms definitions and abbreviated terms
    4 Purpose of long-term storage
    5 Logistics
    6 Storage considerations for devices after card (or other)
       attachment
    7 Handling
    8 Inspection
    9 Inventory control process
    10 Transportation
    11 Lead finishes
    12 Kitting and lot control
    13 Validation
    14 Unplanned storage and types of storage
    15 Other things to store in addition to the components
    16 Storage facility
    17 Policies
    18 Legislation and environmental issues
    Annex A (informative) - Example checklist for project
            managers
    Annex B (normative) - Example checklist for long-term
            storage facilities
    Annex C (informative) - Example of a component list
    Annex D (informative) - Examples of periodic and/or
            de-stocking tests
    Annex E (informative) - Parameters influencing the
            quantity of components to be stored
    Bibliography
    Annex ZA (normative) - Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Contains the terms, definitions and principles of long-term-storage that can be used in as an obsolescence mitigation strategy.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 47-141. (10/2017)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    EN 60749-20-1 : 2009 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective