CEI EN 62435-2 : 1ED 2017
Current
The latest, up-to-date edition.
ELECTRONIC COMPONENTS - LONG-TERM STORAGE OF ELECTRONIC SEMICONDUCTOR DEVICES - PART 2: DETERIORATION MECHANISMS
03-10-2017
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles of deterioration
5 Technical validation of the components
Annex A (normative) - Failure mechanisms - Encapsulated
and non-encapsulated active components
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
Pertains to deterioration mechanisms and is concerned with the way that components degrade over time depending on the storage conditions applied.
| Committee |
CT 309
|
| DevelopmentNote |
Classificazione CEI 47-142. (09/2017)
|
| DocumentType |
Standard
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Standards | Relationship |
| EN 62435-2:2017 | Identical |
| IEC 62435-2:2017 | Identical |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| IEC 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
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