CEI EN IEC 60749-10:2022
Current
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-12-2022
Publisher
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-4493-7
|
| Pages |
20
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN IEC 60749-10:2022 | Identical |
| IEC 60749-10:2022 | Identical |
| JEDEC JESD 51-9:2000 | Test Boards for Area Array Surface Mount Package Thermal Measurements |
| JEDEC JESD 51-10 : 2000 | Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.