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JEDEC JESD 51-10 : 2000

Current

Current

The latest, up-to-date edition.

Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-07-2000

This specification covers through-hole mount perimeter leaded packages intended to be mounted on a PCB. It does not cover area array packages that require sockets or PGA packages.

DocumentType
Standard
Pages
18
ProductNote
This standard also refers toEIA/JESD51, EIA/JESD51-6, EIA/JESD51-2, EIA/JESD51-1
PublisherName
JEDEC Solid State Technology Association
Status
Current

CEI EN IEC 60749-10:2022 Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly

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