JEDEC JESD 51-10 : 2000
Current
Current
The latest, up-to-date edition.
Test Boards for Through-Hole Perimeter Leaded Package Thermal Measurements
Available format(s)
Hardcopy , PDF
Language(s)
English
Published date
01-07-2000
Publisher
This specification covers through-hole mount perimeter leaded packages intended to be mounted on a PCB. It does not cover area array packages that require sockets or PGA packages.
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