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Semiconductor devices - Mechanical and climatic test methods Part 10: Mechanical shock - Device and subassembly
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Available format(s): Hardcopy, PDF
Language(s): English
Published date: 01-12-2022
Publisher: Comitato Elettrotecnico Italiano
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment.
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