CEI EN IEC 60749-37:2023
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods Part 37: Board level drop test method using an accelerometer
Hardcopy , PDF
English
01-04-2023
Important note : Users cannot be edited or removed once added to your Multi user PDF.This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
| Committee |
CT 309
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-5837-8
|
| Pages |
30
|
| PublisherName |
Comitato Elettrotecnico Italiano
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-37:2022 | Identical |
| EN IEC 60749-37:2022 | Identical |
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