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  • CEI EN 60749-37 : 2008

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 37: BOARD LEVEL DROP TEST METHOD USING AN ACCELEROMETER

    Available format(s):  Hardcopy, PDF

    Superseded date:  17-06-2023

    Language(s):  English

    Published date:  01-01-2008

    Publisher:  Comitato Elettrotecnico Italiano

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 Terms and definitions
    4 Test apparatus and components
    5 Test procedure
    6 Failure criteria and failure
      analysis
    7 Summary
    Annex A (informative) - Preferred
            board construction,
            material, design and layout
    Bibliography

    Abstract - (Show below) - (Hide below)

    Defines to provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.

    General Product Information - (Show below) - (Hide below)

    Committee CT 309
    Development Note Classificazione CEI 47-63. (11/2008)
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    EN 60749-20:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60749-40:2011 Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge
    IEC 60749-20-1:2009 Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat
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