CEI EN IEC 60749-37:2023
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods Part 37: Board level drop test method using an accelerometer
Hardcopy , PDF
English
01-04-2023
This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
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