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  • CEI EN IEC 61190-1-3:2018

    Current The latest, up-to-date edition.

    Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017)

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  22-03-2019

    Publisher:  Comitato Elettrotecnico Italiano

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    Abstract - (Show below) - (Hide below)

    This part of IEC 61190 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders.

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    Committee CT 309
    Document Type Standard
    Publisher Comitato Elettrotecnico Italiano
    Status Current
    Supersedes
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