EN IEC 61190-1-3:2018

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Classification
5 Requirements
6 Quality assurance provisions
7 Preparation for delivery - Preservation, packing and packaging
Annex A (informative) - Selection of various alloys
        and fluxes for use in electronic soldering - General
        information concerning IEC 61190-1-3
Annex B (normative) - Lead-free solder alloys
Annex C (informative) - Marking method of solder
        designation for mounted board, used in
        electronic equipment
Bibliography
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

IEC61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO9453. This document is a quality control document and is not intended to relate directly to the material's performance in the manufacturing process.This edition includes the following significant technical changes with respect to the previous edition:a) The maximum impurity level of Pb has been revised and the table of lead free solder alloys includes some additional lead free solder alloys.