DI-MGMT-81772 Base Document:2009
Current
The latest, up-to-date edition.
LEAD-FREE CONTROL PLAN (LFCP)
English
Important note : Users cannot be edited or removed once added to your Multi user PDF.Attains essential information from contractors on how they plan to manage the risk of lead-free solders or finishes used in their products during the program's lifecycle. Applies to all new contracts and solicitations that acquire electronic systems including weapons systems containing electronic components as well as rework or repair of electronic systems or components.
| Committee |
MGMT
|
| DocumentType |
Standard
|
| Pages |
2
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Current
|
| GEIA STD 0005-2 : 2012 | MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS |
| GEIA STD 0005-1 : 2012 | PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER |
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