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  • GEIA STD 0005-2 : 2012

    Current The latest, up-to-date edition.

    MITIGATING THE EFFECTS OF TIN WHISKERS IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  31-12-2011

    Publisher:  Government Electronics & Information Technology Association

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    Table of Contents - (Show below) - (Hide below)

    Foreword
    Introduction
    1 Scope
    2 Terms and Definitions
    3 Requirements
    4 Implementation Methods
    Annex A - Guidance on Control Levels, Risk Assessment,
              and Mitigation Evaluation
    Annex B - Technical Guide on Detection Methods,
              Mitigation Methods, and Methods for Limiting Impact
              of Pb-free Tin Finishes
    Annex C - Tin Whisker Inspection
    Annex D - Analysis and Risk Assessment Guidance
    Annex E - Whiskers Growing from Solder Joint Fillets
              and Bulk Solder
    Annex F - Bibliography

    Abstract - (Show below) - (Hide below)

    Specifies processes for documenting the mitigating steps taken to reduce the harmful effects of Pb-free tin finishes in electronic systems.

    General Product Information - (Show below) - (Hide below)

    Committee G-12
    Document Type Standard
    Publisher Government Electronics & Information Technology Association
    Status Current

    Standards Referenced By This Book - (Show below) - (Hide below)

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    SAE ARP 5890 : 2011 GUIDELINES FOR PREPARING RELIABILITY ASSESSMENT PLANS FOR ELECTRONIC ENGINE CONTROLS
    PD IEC/TS 62647-1:2012 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Preparation for a lead-free control plan
    IEC PAS 62647-23:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
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    IEC TS 62647-3:2014 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 3: Performance testing for systems containing lead-free solder and finishes
    IEC TS 62239-1:2015 Process management for avionics - Management plan - Part 1: Preparation and maintenance of an electronic components management plan
    GEIA HB 0005-3 : 2008 REWORK/REPAIR HANDBOOK TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES IN AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS
    GEIA HB 0005-2 : 2007 TECHNICAL GUIDELINES FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    NASA KSC STD E 0001 : 2008 DESIGN OF ELECTRICAL CONTROL AND MONITORING SYSTEMS, EQUIPMENT (GSE), AND PANELS, STANDARD FOR
    GEIA STD 0006 : 2008 REQUIREMENTS FOR USING ROBOTIC HOT SOLDER DIP TO REPLACE THE FINISH ON ELECTRONIC PIECE PARTS
    NASA STD 6016 : 2016 STANDARD MATERIALS AND PROCESSES REQUIREMENTS FOR SPACECRAFT
    GEIA STD 0005-1 : 2012 PERFORMANCE STANDARD FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER
    EIA STD 4899 : 2017-05 REQUIREMENTS FOR AN ELECTRONIC COMPONENTS MANAGEMENT PLAN
    GEIA STD 0005-3 : 2013 PERFORMANCE TESTING FOR AEROSPACE AND HIGH PERFORMANCE ELECTRONIC INTERCONNECTS CONTAINING PB-FREE SOLDER AND FINISHES
    NASA JSC 66491 : 2013 STANDARD FOR JSC LEAD-FREE CONTROL PLANS (LFCP)
    IEC TS 62647-1:2012 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 1: Preparation for a lead-free control plan
    ARINC 671 : 2006 GUIDANCE FOR THE TRANSITION TO LEAD-FREE SOLDERING, MAINTENANCE, AND REPAIR
    SAE AS 12500 : 2018 CORROSION PREVENTION AND DETERIORATION CONTROL IN ELECTRONIC COMPONENTS AND ASSEMBLIES
    IEC PAS 62647-21:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 21: Program management - Systems engineering guidelines for managing the transition to lead-free electronics
    PD IEC/TS 62239-1:2015 Process management for avionics. Management plan Preparation and maintenance of an electronic components management plan
    IEC TS 62647-23:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 23: Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    PD IEC/TS 62647-23:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Rework and repair guidance to address the implications of lead-free electronics and mixed assemblies
    IEC TS 62647-22:2013 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    IEC PAS 62647-22:2011 Process management for avionics - Aerospace and defence electronic systems containing lead-free solder - Part 22: Technical guidelines
    DD IEC PAS 62647-23 : DRAFT AUG 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 23: REWORK AND REPAIR GUIDANCE TO ADDRESS THE IMPLICATIONS OF LEAD-FREE ELECTRONICS AND MIXED ASSEMBLIES
    PD IEC/TS 62647-3:2014 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Performance testing for systems containing lead-free solder and finishes
    DD IEC PAS 62647-3 : DRAFT SEP 2011 PROCESS MANAGEMENT FOR AVIONICS - AEROSPACE AND DEFENCE ELECTRONIC SYSTEMS CONTAINING LEAD-FREE SOLDER - PART 3: PERFORMANCE TESTING FOR SYSTEMS CONTAINING LEAD-FREE SOLDER AND FINISHES
    PD IEC/TS 62647-22:2013 Process management for avionics. Aerospace and defence electronic systems containing lead-free solder Technical guidelines
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