DIN EN 123300:1992-11

Withdrawn

SECTIONAL SPECIFICATION; MULTILAYER PRINTED BOARDS

Available format(s)

Hardcopy , PDF

Withdrawn date

07-03-2021

Published date

01-01-1992

Publisher

German Institute for Standardisation (Deutsches Institut für Normung)

VORBEMERKUNG
VORWORT
Abschnitt
1 Einführung
  1.1 Geltungsbereich und Zweck
  1.2 Bezugsdokumente
2 Allgemeines
3 Prüflinge
  3.1 Befähigungsprüfprogramm
  3.2 Gütebestätigungskontrollen
4 Einzelbestimmung
5 Leiterplattenmerkmale
  Tabelle I
  Tabelle II
6 Befähigungsprüfprogramm
7 Gütebestätigungskontrollen
8 Prüfbilder
  8.1 Anwendung von Prüfbildern
      und Prüfplatten
  8.2 Kombiniertes Prüfbild (CTP)
  8.3 Lagenaufbau der Prüfplatten
  8.4 Mehrfachanordnungen des CTP
Bild 2: Kombiniertes Prüfbild
Bild 3: Beispiele gelöteter Löcher

Applies to multilayer printed boards regardless of their method of manufacture, when they are ready for mounting of components. Defines characteristics to be assessed and test methods to be used for capability approval testing and for quality conformance inspection (lot-by-lot and periodic inspection).

DocumentType	Standard
Pages	36
PublisherName	German Institute for Standardisation (Deutsches Institut für Normung)
Status	Withdrawn

Standards	Relationship
CECC 23300 : 85 AMD 1	Identical
EN 123300 : 1992 AMD 1 1995	Identical
BS EN 123300:1992	Identical
NEN EN 123300 : 1995 AMD 1 1995	Identical
SN EN 123300 : AMD 1 1995	Identical
I.S. EN 123300:1994	Identical

DIN IEC 60194:1992-11	PRINTED CIRCUITS; TERMS AND DEFINITION
DIN EN 123000 : 92 AMD 2 97	GENERIC SPECIFICATION; PRINTED BOARDS
DIN IEC 60326-2 : 1992 AMD 1 1993	PRINTED BOARDS; PART 2: TEST METHODS
DIN IEC 60326-6:1994-07	PRINTED BOARDS - PART 6: SPECIFICATION FOR MULTILAYER PRINTED BOARDS

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DIN EN 123300:1992-11

SECTIONAL SPECIFICATION; MULTILAYER PRINTED BOARDS

Table of Contents

Abstract

General Product Information

International Equivalents

Standards Referencing This Book

Category

Subcategory