Skip to content
Please enter a keyword to search

  • BS EN 123300:1992

    Current The latest, up-to-date edition.

    Specification for harmonized system of quality assessment for electronic components. Sectional specification. Multilayer printed boards

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  31-08-1989

    Publisher:  British Standards Institution

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    Foreword
    Preface
    1. Introduction
    1.1 Scope and object
    1.2 Related documents
    2. General
    3. Test specimens
    3.1 Capability approval
    3.2 Quality conformance inspection
    4. Relevant specification
    5. Characteristics of printed boards
          Table I
          Table II
    6. Capability test programme
    7. Quality conformance inspection
    8. Test patterns
    8.1 Application of test patterns and test boards
    8.2 Composite test pattern (CTP)
    8.3 Structure of test boards
    8.4 Multiple arrangements of the CTP
    Figure 2 - Composite test pattern
    Figure 3 - Examples of soldered holes

    Abstract - (Show below) - (Hide below)

    Defines the characteristics to be assessed and the test methods to be used for capability approval testing and quality conformance inspection.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Renumbers and supersedes BS CECC23300(1989). 1992 Version incorporates amendment 7364 to BS CECC23300(1989). Supersedes 86/31650 DC and 94/216046 DC. (09/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS CECC 23300-003:1996 Harmonized system of quality assessment for electronic components. Capability detail specification: multilayer printed boards

    Standards Referencing This Book - (Show below) - (Hide below)

    CECC 00107(PT3) : 80 AMD 1 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR CAPABILITY APPROVAL
    BS CECC23000(1989) : 1989 AMD 7145 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERAL SPECIFICATION: PRINTED BOARDS
    CECC 00010 : 1980 AMD 1 BASIC SPECIFICATION: TEST METHODS FOR PRINTED BOARDS
    CECC 00107(PT2) : 79 AMD 1 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - PROCEDURE FOR ENHANCED ASSESSMENT OF QUALITY
    BS 6221-2:1991 Printed wiring boards Methods of test
    CECC 00107(PT1) : 1982 CECC RULES OF PROCEDURE: RP7: QUALITY ASSESSMENT PROCEDURES - QUALITY ASSESSMENT PROCEDURE FOR GENERAL USAGE
    IEC 60194:2015 Printed board design, manufacture and assembly - Terms and definitions
    CECC 00111 : 80 AMD 3 CECC RULES OF PROCEDURE: RP 11: SPECIFICATIONS AND THEIR HARMONIZATION - COMPONENTS FOR GENERAL AND PROFESSIONAL USAGE - COMPONENTS OF ENHANCED ASSESSMENT OF QUALITY
    BS 4584:1970 Specification for metal clad base materials for printed circuits. Methods of test
    IEC 60326-3:1991 Printed boards - Part 3: Design and use of printed boards
    BS 2011(1967) : LATEST
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective