DIN EN 60603-13:1998-09
Current
The latest, up-to-date edition.
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 13: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS OF ASSESSED QUALITY, FOR PRINTED BOARDS FOR BASIC GRID OF 2,54 MM (0,1 IN), WITH FREE CONNECTORS FOR NON-ACCESSIBLE INSULATION DISPLACEMENT TERMINATIONS (ID)
Hardcopy , PDF
01-01-1998
1 Anwendungsbereich
2 Normative Verweisungen
3 IEC-Normbezeichnung
4 Gemeinsame Merkmale
4.1 Isometrische Darstellung
4.2 Übersicht der Bauformen
5 Masse
5.1 Allgemeines
5.2 Feste Steckverbinder
5.3 Freie Steckverbinder
5.4 Montageangaben für feste Steckverbinder,
Bauform A und B
6 Lehren
7 Kennwerte
7.1 Klimatische Klassen
7.2 Elektrische Kennwerte
7.3 Mechanische Kennwerte
8 Prüfprogramm
8.1 Allgemeines
9 Bauartanerkennungsverfahren
9.1 Bauartanerkennungsprüfungen
9.2 Qualitätsbewertungskontrollen
9.3 Verzögerte Lieferung, Nachprüfung
10 Bestellangaben
Anhang A (normativ) Prüfablauf Nr 3.2: Korrosion,
Industrieatmosphäre
Anhang ZA (normativ) Normative Verweisungen auf
internationale Publikationen mit ihren
entsprechenden europäischen Publikationen
Describes a range of two-part connectors having contact arrangements with spacings of 2.54 mm in both directions.
DevelopmentNote |
Supersedes DIN 41651-1 and DIN 41651-2 (07/2002)
|
DocumentType |
Standard
|
Pages |
37
|
PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
Status |
Current
|
Supersedes |
Standards | Relationship |
NF EN 60603-13 : 1998 | Identical |
NBN EN 60603-13 : 1998 | Identical |
SN EN 60603-13 : 1998 | Identical |
IEC 60603-13:1995 | Identical |
EN 60603-13:1998 | Identical |
BS EN 60603-13:1998 | Identical |
DIN EN 60097:1993-09 | Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993 |
DIN IEC 60512-8:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 8: CONNECTOR TESTS (MECHANICAL) & MECHANICAL TESTS ON CONTACTS & TERMINATIONS |
DIN EN 60352-4:2001-09 | Solderless connections - Part 4: Solderless non-accessible insulation displacement connections; General requirements, test methods and practical guidance (IEC 60352-4:1994 + A1:2000); German version EN 60352-4:1994 + A1:2000 |
DIN IEC 60512-7:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 7: MECHANICAL OPERATING TESTS AND SEALING TESTS |
DIN IEC 60512-2 : 1994 AMD 1 1995 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 2: GENERAL EXAMINATION, ELECTRICAL CONTINUITY AND CONTACT RESISTANCE TESTS, INSULATION TESTS AND VOLTAGE STRESS TESTS |
DIN EN 60512-1:2001-11 | CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 1: GENERAL |
DIN IEC 60512-4:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 4: DYNAMIC STRESS TESTS |
DIN EN 60352-5:2012-10 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2012); German version EN 60352-5:2012 |
DIN EN 60068-1 : 2015 | ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013) |
DIN EN 60068-2-60 : 2016 | ENVIRONMENTAL TESTING - PART 2-60: TESTS - TEST KE: FLOWING MIXED GAS CORROSION TEST (IEC 60068-2-60:2015) |
DIN EN 60603-1:1998-07 | CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 1: GENERIC SPECIFICATION: GENERAL REQUIREMENTS AND GUIDE FOR THE PREPARATION OF DETAIL SPECIFICATIONS, WITH ASSESSED QUALITY |
DIN IEC 60512-3:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS - PART 3: CURRENT-CARRYING CAPACITY TESTS |
DIN IEC 60512-5:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURE AND MEASURING METHODS; PART 5: IMPACT TESTS (FREE COMPONENTS), STATIC LOAD TESTS (FIXED COMPONENTS), ENDURANCE TESTS AND OVERLOAD TESTS |
DIN IEC 60512-9:1994-05 | ELECTROMECHANICAL COMPONENTS FOR ELECTRONIC EQUIPMENT; BASIC TESTING PROCEDURES AND MEASURING METHODS; PART 9: MISCELLANEOUS TESTS |
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