DIN EN 60603-2:2006-04
Current
The latest, up-to-date edition.
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 2: DETAIL SPECIFICATION FOR TWO-PART CONNECTORS WITH ASSESSED QUALITY, FOR PRINTED BOARDS, FOR BASIC GRID OF 2.54 MM (0.1 IN) WITH COMMON MOUNTING FEATURES
Hardcopy , PDF
German
01-01-2006
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1 Anwendungsbereich
2 Normative Verweisungen
3 IEC-Normbezeichnung
4 Gemeinsame Merkmale
4.1 Montagemasse
4.2 Steckbedingungen
4.3 Übersicht der Bauformen
5 Masse
5.1 Allgemeines
5.2 Feste Leiterplattensteckverbinder
5.3 Freie Leiterplattensteckverbinder
5.4 Steckbedingungen
5.5 Zubehör
5.6 Montagehinweise für feste Leiterplatten
steckverbinder
5.7 Montagehinweise für freie Leiterplatten
steckverbinder
6 Lehren
6.1 Aufweit- und Ziehkraftlehren
6.2 Prüfplatte (Prüfung der Spannungsfestigkeit)
7 Kennwerte
7.1 Klimatische Klassen
7.2 Elektrische Kennwerte
7.3 Mechanische Kennwerte
8 Prüfprogramm
8.1 Allgemeines
9 Bauartanerkennungsverfahren
9.1 Bauartanerkennungsprüfungen
9.2 Qualitätskonformitätskontrollen
9.3 Verzögerte Lieferung, Nachprüfung
10 Bestellangaben
Anhang A (normativ) Prüfablauf BP 3.2: Korrosion,
Industrieatmosphäre
Anhang B (informativ) Sonderkontakte für
Steckverbinder der Bauform M
Anhang ZA (normativ) Normative Verweisungen auf
internationale Publikationen mit ihren
entsprechenden europäischen Publikationen
Applicable to groups of related connectors to be used with printed boards. Include connectors with high contact density for low-voltage applications and range to connectors for heavy currents and high voltages with fewer contacts.
| DevelopmentNote |
Supersedes DIN 41612-1, -2, -3, -4, -5, -6, -7, -8, -9, -10, -102 DIN 41612-1 SUPP1, DIN 41612-8 SUPP1 and DIN IEC 48B-206. (10/1999)
|
| DocumentType |
Standard
|
| Pages |
93
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NBN EN 60603-2 : 1999 AMD 1 2007 | Identical |
| SN EN 60603-2 : 1998 | Identical |
| NF EN 60603-2 : 1999 AMD 1 2005 | Identical |
| I.S. EN 60603-2:1998 | Identical |
| BS EN 60603-2:1998 | Identical |
| EN 60603-2:1998/A1:2005 | Identical |
| DIN EN 60097:1993-09 | Grid systems for printed circuits (IEC 60097:1991); German version EN 60097:1993 |
| DIN IEC 60760:1991-04 (Draft) | FLAT, QUICK-CONNECT TERMINATIONS |
| DIN EN 60352-4:2001-09 | Solderless connections - Part 4: Solderless non-accessible insulation displacement connections; General requirements, test methods and practical guidance (IEC 60352-4:1994 + A1:2000); German version EN 60352-4:1994 + A1:2000 |
| DIN ISO 2859-1:2014-08 | SAMPLING PROCEDURES FOR INSPECTION BY ATTRIBUTES - PART 1: SAMPLING SCHEMES INDEXED BY ACCEPTANCE QUALITY LIMIT (AQL) FOR LOT-BY-LOT INSPECTION (ISO 2859-1:1999 + COR. 1:2001 + AMD.1:2011) |
| DIN IEC 60326-3:1993-09 | PRINTED BOARDS - PART 3: DESIGN AND USE OF PRINTED BOARDS |
| DIN IEC 60194:1992-11 | PRINTED CIRCUITS; TERMS AND DEFINITION |
| DIN EN 60352-5:2012-10 | Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2012); German version EN 60352-5:2012 |
| DIN EN 60068-1 : 2015 | ENVIRONMENTAL TESTING - PART 1: GENERAL AND GUIDANCE (IEC 60068-1:2013) |
| DIN EN 60068-2-60 : 2016 | ENVIRONMENTAL TESTING - PART 2-60: TESTS - TEST KE: FLOWING MIXED GAS CORROSION TEST (IEC 60068-2-60:2015) |
| DIN EN 60603-1:1998-07 | CONNECTORS FOR FREQUENCIES BELOW 3 MHZ FOR USE WITH PRINTED BOARDS - PART 1: GENERIC SPECIFICATION: GENERAL REQUIREMENTS AND GUIDE FOR THE PREPARATION OF DETAIL SPECIFICATIONS, WITH ASSESSED QUALITY |
| DIN EN 60352-1:1998-04 | SOLDERLESS CONNECTIONS - PART 1: WRAPPED CONNECTIONS - GENERAL REQUIREMENTS, TEST METHODS AND PRACTICAL GUIDANCE |
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