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DIN EN 60747-15:2012-08
Current
The latest, up-to-date edition.
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SEMICONDUCTOR DEVICES - DISCRETE DEVICES - PART 15: ISOLATED POWER SEMICONDUCTOR DEVICES (IEC 60747-15:2010)
Hardcopy , PDF
German
01-01-2012
1 Scope
2 Normative references
3 Terms and definitions
4 Letter symbols
4.1 General
4.2 Additional subscripts/symbols
4.3 List letter symbols
5 Essential ratings (limiting values) and characteristics
5.1 General
5.2 Ratings (limiting values)
5.3 Characteristics
6 Verification of ratings (limiting values)
6.1 Isolation voltage between terminals and base plate
(V[isol])
6.2 Peak case non-rupture current
6.3 Maximum terminal current (I[tRMS])
6.4 Surge (non-repetitive) current test (I[FSM]; I[TSM])
7 Methods of measurement of characteristics
7.1 Rated partial discharge inception and extinction
voltages (V[i]) (V[e])
7.2 Parasitic stray inductance between main terminals (L[P])
7.3 Parasitic stray capacitance of functional circuit
elements to case (C[P])
7.4 Measuring methods for thermal characteristics
7.5 Measuring methods of mechanical characteristics
8 Acceptance and reliability
8.1 General requirements
8.2 List of endurance tests
8.3 Type tests and routine tests of isolated power devices
Annex A (informative) Test method for peak case non-rupture
current
A.1 Purpose
A.2 Circuit diagram
A.3 Circuit description and requirements
A.4 Test procedure
A.5 Post-test measurements and criteria
A.6 Specified conditions
A.7 Reference documents
Annex B (informative) Measuring method of the thickness of
thermal compound paste
B.1 Background information to 7.4.2
B.2 Measuring method
Annex C (informative) Climatic parameters and characteristics
C.1 Background information to 5.3.8
Annex D (informative) Internal circuit configurations
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
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