IEC 60112:2003+AMD1:2009 CSV
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Method for the determination of the proof and the comparative tracking indices of solid insulating materials |
IEC 60270:2000+AMD1:2015 CSV
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High-voltage test techniques - Partial discharge measurements |
IEC 60747-7:2010
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Semiconductor devices - Discrete devices - Part 7: Bipolar transistors |
IEC 61287-1:2014
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Railway applications - Power converters installed on board rolling stock - Part 1: Characteristics and test methods |
EN 60749-15:2010/AC:2011
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 15: RESISTANCE TO SOLDERING TEMPERATURE FOR THROUGH-HOLE MOUNTED DEVICES |
IEC 60749-21:2011
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Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability |
IEC 60749-25:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
IEC 60749-5:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
EN 60749-34:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
EN 60270:2001/A1:2016
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HIGH-VOLTAGE TEST TECHNIQUES - PARTIAL DISCHARGE MEASUREMENTS (IEC 60270:2000/A1:2015) |
EN 60749-5:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test |
IEC 60747-9:2007
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Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs) |
EN 60749-21:2011
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SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY |
IEC 60747-8:2010
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Semiconductor devices - Discrete devices - Part 8: Field-effect transistors |
IEC 60749-15:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices |
EN 60749-10:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
EN 60664-1:2007
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Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
IEC 60747-1:2006+AMD1:2010 CSV
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Semiconductor devices - Part 1: General |
IEC 60749-34:2010
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Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling |
IEC 60749-6:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
IEC 60721-3-3:1994+AMD1:1995+AMD2:1996 CSV
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Classification of environmental conditions - Part 3-3: Classification of groups of environmental parameters and their severities - Stationary use at weatherprotected locations |
EN 60749-6:2017
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Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature |
IEC 60749-10:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock |
IEC 60747-6:2016
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Semiconductor devices - Part 6: Discrete devices - Thyristors |
EN 60749-25:2003
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Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling |
IEC 60664-1:2007
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Insulation coordination for equipment within low-voltage systems - Part 1: Principles, requirements and tests |
IEC 60747-2:2016
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Semiconductor devices - Part 2: Discrete devices - Rectifier diodes |
IEC 60749-12:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
EN 60749-12:2002
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Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency |
EN 60721-3-3 : 95 AMD 2 97
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CLASSIFICATION OF ENVIRONMENTAL CONDITIONS - CLASSIFICATION OF GROUPS OF ENVIRONMENTAL PARAMETERS AND THEIR SEVERITIES - STATIONARY USE AT WEATHER-PROTECTED LOCATIONS |