DIN EN 60749-21:2012-01
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY (IEC 60749-21:2011)
Hardcopy , PDF
German
01-01-2012
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1 Scope
2 Test apparatus
2.1 Solder bath
2.2 Dipping device
2.3 Optical equipment
2.4 Steam ageing equipment
2.5 Lighting equipment
2.6 Materials
2.6.1 Flux
2.6.2 Solder
2.7 SMD reflow equipment
2.7.1 Stencil or screen
2.7.2 Rubber squeegee or metal spatula
2.7.3 Test substrate
2.7.4 Solder paste
2.7.5 Reflow equipment
2.7.6 Flux removal solvent
3 Procedure
3.1 Preconditioning
3.1.1 Preconditioning by steam ageing
3.1.2 Preconditioning by high temperature storage
3.2 Procedure for dip and look solderability testing
3.2.1 Solder dip conditions
3.2.2 Procedure
3.3 Procedure for simulated board mounting reflow solderability
testing of SMDs
3.3.1 Test equipment set-up
3.3.2 Specimen preparation and surface condition
3.3.3 Visual inspection
4 Summary
| DevelopmentNote |
Supersedes DIN EN 60749 and DIN IEC 60749-21. (06/2005)
|
| DocumentType |
Standard
|
| Pages |
23
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| NBN EN 60749-21 : 2011 | Identical |
| IEC 60749-21:2011 | Identical |
| EN 60749-21:2011 | Identical |
| I.S. EN 60749-21:2011 | Identical |
| NF EN 60749-21 : 2012 | Identical |
| BS EN 60749-21:2011 | Identical |
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