I.S. EN 60749-21:2011
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 21: SOLDERABILITY
Hardcopy , PDF
English
01-01-2011
02-03-2026
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Test apparatus
4 Procedure
5 Summary
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Constitutes a standard procedure for determining the solderability of device package terminations that are intended to be joined to another surface using tin-lead (SnPb) or lead-free (Pb-free) solder for the attachment.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
28
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NBN EN 60749-21 : 2011 | Identical |
| DIN EN 60749-21:2012-01 | Identical |
| BS EN 60749-21:2011 | Identical |
| IEC 60749-21:2011 | Identical |
| EN 60749-21:2011 | Identical |
| NF EN 60749-21 : 2012 | Identical |
| IEC 60749-21:2011 | Equivalent |
| UNE-EN 60749-21:2011 | Equivalent |
A newer version of this standard is available.
View Current Edition
Please Login or Create an Account so you can add users to your Multi user PDF Later.
Important note : Users cannot be edited or removed once added to your Multi user PDF.