DIN EN 60749-30:2011-12
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing (IEC 60749-30:2005 + A1:2011); German version EN 60749-30:2005 + A1:2011
Hardcopy , PDF
01-02-2023
German
01-12-2011
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1 Scope
2 Normative references
3 General description
4 Test apparatus and materials
4.1 Moisture chamber
4.2 Solder equipment
4.3 Optical microscope
4.4 Electrical test equipment
4.5 Drying (bake) oven
4.6 Temperature cycle chamber (optional)
5 Procedure
5.1 General
5.2 Initial measurements
5.3 Temperature cycling (optional)
5.4 Drying (bake out)
5.5 Soak conditions for dry-packed SMDs
5.6 Method C for soak conditions for
non-dry-packed SMDs in accordance with
IEC 60749-20
5.7 Solder reflow
5.8 Flux application simulation (optional)
5.9 Final measurements
5.10 Applicable reliability tests
6 Summary
Annex ZA (normative) Normative references to international
publications with their corresponding
European publications
| DevelopmentNote |
Supersedes DIN IEC 60749-30 (06/2005)
|
| DocumentType |
Standard
|
| Pages |
14
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| BS EN 60749-30 : 2005 | Identical |
| NF EN 60749-30 : 2005 AMD 1 2011 | Identical |
| IEC 60749-30:2005+AMD1:2011 CSV | Identical |
| EN 60749-30 : 2005 AMD 1 2011 | Identical |
| I.S. EN 60749-30:2005 | Identical |
| NBN EN 60749-30 : 2006 AMD 1 2011 | Identical |
| UNE-EN 60749-30:2005 | Identical |
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