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  • NF EN 60749-30 : 2005 AMD 1 2011

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 30: PRECONDITIONING OF NON-HERMETIC SURFACE MOUNT DEVICES PRIOR TO RELIABILITY TESTING

    Available format(s): 

    Superseded date:  01-11-2021

    Language(s): 

    Published date:  12-01-2013

    Publisher:  Association Francaise de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    1 Scope
    2 Normative references
    3 General description
    4 Test apparatus and materials
      4.1 Moisture chamber
      4.2 Solder equipment
      4.3 Optical microscope
      4.4 Electrical test equipment
      4.5 Drying (bake) oven
      4.6 Temperature cycle chamber (optional)
    5 Procedure
      5.1 General
      5.2 Initial measurements
      5.3 Temperature cycling (optional)
      5.4 Drying (bake out)
      5.5 Soak conditions for dry-packed SMDs
      5.6 Method C for soak conditions for
           non-dry-packed SMDs in accordance with
           IEC 60749-20
      5.7 Solder reflow
      5.8 Flux application simulation (optional)
      5.9 Final measurements
      5.10 Applicable reliability tests
    6 Summary
    Annex ZA (normative) Normative references to international
                         publications with their corresponding
                         European publications

    Abstract - (Show below) - (Hide below)

    Defines a standard procedure for determining the preconditioning of non-hermetic surface mount devices (SMDs) prior to reliability testing.

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    Development Note Indice de classement: C96-022-30 PR NF EN 60749-30 March 2004 (03/2004)
    Document Type Standard
    Publisher Association Francaise de Normalisation
    Status Superseded
    Superseded By

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-20:2008 Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat
    NF EN 60749-11 : 2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 11: RAPID CHANGE OF TEMPERATURE - TWO-FLUID-BATH METHOD
    IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    NF EN 60749-5 : 2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 5: STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
    IEC 60749-5:2017 Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test
    IEC 60749-4:2017 Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)
    NF EN 60749-4 : 2002 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 4: DAMP HEAT, STEADY STATE, HIGHLY ACCELERATED STRESS TEST (HAST)
    IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    IEC 60749-33:2004 Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave
    IEC 60749-24:2004 Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST
    NF EN 60749-33 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 33: ACCELERATED MOISTURE RESISTANCE - UNBIASED AUTOCLAVE
    NF EN 60749-24 : 2005 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 24: ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
    NF EN 60749-20 : 2010 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20: RESISTANCE OF PLASTIC ENCAPSULATED SMDS TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT
    NF EN 60749-25 : 2003 SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 25: TEMPERATURE CYCLING
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