DIN EN 61188-5-6:2003-10
Current
The latest, up-to-date edition.
PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS; CHIP CARRIERS WITH J-LEADS ON FOUR SIDES
Hardcopy , PDF
German
01-01-2003
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INTRODUCTION
1 Scope and object
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 QFJ (square)
4.1 Introductory remark
4.2 Component description
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 QFJ (rectangular)
5.1 Introductory remark
5.2 Component description
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
Figures
Specifies information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.
| DevelopmentNote |
Supersedes DIN IEC 52-577-CD. (10/2003)
|
| DocumentType |
Standard
|
| Pages |
21
|
| PublisherName |
German Institute for Standardisation (Deutsches Institut für Normung)
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 61188-5-6 : 2003 | Identical |
| BS EN 61188-5-6:2003 | Identical |
| IEC 61188-5-6:2003 | Identical |
| I.S. EN 61188-5-6:2003 | Identical |
| EN 61188-5-6:2003 | Identical |
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