• DIN EN 61189-6:2007-03

    Current The latest, up-to-date edition.

    TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 6: TEST METHODS FOR MATERIALS USED IN MANUFACTURING ELECTRONIC ASSEMBLIES

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-2007

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Accuracy, precision and resolution
       3.1 Accuracy
       3.2 Precision
       3.3 Resolution
       3.4 Report
       3.5 Student's "t" distribution
       3.6 Suggested uncertainty limits
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
    6 V: Visual test methods
    7 D: Dimensional test methods
    8 C: Chemical test methods
       8.1 Test 6C01: Determination of acid value of liquid
            soldering flux - potentiometric and visual titration
            methods
       8.2 Test 6C02: Determination of halides in fluxes,
            silver chromate method
       8.3 Test 6C03: Solids content, flux
       8.4 Test 6C04: Quantitative determination of halide
            content in fluxes (chloride and bromide)
       8.5 Test 6C05: Qualitative analysis of fluorides and
            fluxes by spot test
       8.6 Test 6C06: Quantitative determination of fluoride
            concentration in fluxes
       8.7 Test 6C07: Acid number of rosin
       8.8 Test 6C08: Specific gravity
       8.9 Test 6C09: Determination of the percentage of flux on/in
            flux-coated and/or flux-cored solder
       8.10 Test 6C10: Flux induced corrosion (copper mirror method)
    9 M: Mechanical test methods
    10 E: Electrical test methods
    11 N: Environmental test methods
    12 X: Miscellaneous test methods
       12.1 Test 6X01: Determination of solder powder particle
            size distribution - Screen method for types 1-4
       12.2 Test 6X02: Solder powder particle size
            distribution-measuring microscope method
       12.3 Test 6X03: Solder powder particle size distribution -
            Optical image analyzer method
       12.4 Test 6X04: Solder powder particle size distribution -
            Measuring laser diffraction method
       12.5 Test 6X05: Determination of maximum solder powder
            particle size
       12.6 Test 6X06: Solder paste metal content by weight
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Presents a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

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    Development Note Supersedes DIN IEC 61189-6. (03/2007)
    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
    Supersedes
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