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  • BS EN 61189-6:2006

    Current The latest, up-to-date edition.

    Test methods for electrical materials, interconnection structures and assemblies Test methods for materials used in manufacturing electronic assemblies

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  29-09-2006

    Publisher:  British Standards Institution

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope
    2 Normative references
    3 Accuracy, precision and resolution
       3.1 Accuracy
       3.2 Precision
       3.3 Resolution
       3.4 Report
       3.5 Student's "t" distribution
       3.6 Suggested uncertainty limits
    4 Catalogue of approved test methods
    5 P: Preparation/conditioning test methods
    6 V: Visual test methods
    7 D: Dimensional test methods
    8 C: Chemical test methods
       8.1 Test 6C01: Determination of acid value of liquid
            soldering flux - potentiometric and visual titration
            methods
       8.2 Test 6C02: Determination of halides in fluxes,
            silver chromate method
       8.3 Test 6C03: Solids content, flux
       8.4 Test 6C04: Quantitative determination of halide
            content in fluxes (chloride and bromide)
       8.5 Test 6C05: Qualitative analysis of fluorides and
            fluxes by spot test
       8.6 Test 6C06: Quantitative determination of fluoride
            concentration in fluxes
       8.7 Test 6C07: Acid number of rosin
       8.8 Test 6C08: Specific gravity
       8.9 Test 6C09: Determination of the percentage of flux on/in
            flux-coated and/or flux-cored solder
       8.10 Test 6C10: Flux induced corrosion (copper mirror method)
    9 M: Mechanical test methods
    10 E: Electrical test methods
    11 N: Environmental test methods
    12 X: Miscellaneous test methods
       12.1 Test 6X01: Determination of solder powder particle
            size distribution - Screen method for types 1-4
       12.2 Test 6X02: Solder powder particle size
            distribution-measuring microscope method
       12.3 Test 6X03: Solder powder particle size distribution -
            Optical image analyzer method
       12.4 Test 6X04: Solder powder particle size distribution -
            Measuring laser diffraction method
       12.5 Test 6X05: Determination of maximum solder powder
            particle size
       12.6 Test 6X06: Solder paste metal content by weight
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications

    Abstract - (Show below) - (Hide below)

    Presents a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

    Scope - (Show below) - (Hide below)

    IEC 61189-6:2006 is a catalogue of test methods representing methodologies and procedures that can be applied to materials used in manufacturing electronic assemblies.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Supersedes 02/206656 DC (10/2006)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    EN 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    EN 60068-1:2014 Environmental testing - Part 1: General and guidance
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    EN ISO 9001:2015 Quality management systems - Requirements (ISO 9001:2015)
    IEC 61190-1-1:2002 Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
    ISO 9001:2015 Quality management systems — Requirements
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    EN 61190-1-3:2007/A1:2010 ATTACHMENT MATERIALS FOR ELECTRONIC ASSEMBLY - PART 1-3: REQUIREMENTS FOR ELECTRONIC GRADE SOLDER ALLOYS AND FLUXED AND NON-FLUXED SOLID SOLDER FOR ELECTRONIC SOLDERING APPLICATIONS
    IEC 61190-1-3:2007+AMD1:2010 CSV Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
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