• DIN EN 61249-8-8:1998-01

    Current The latest, up-to-date edition.

    MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS; SECTION 8: TEMPORARY POLYMER COATINGS

    Available format(s):  Hardcopy, PDF

    Language(s):  German

    Published date:  01-01-1998

    Publisher:  German Institute for Standardisation (Deutsches Institut für Normung)

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    Abstract - (Show below) - (Hide below)

    Gives requirements for qualification of temporary solder resist coatings, known as masks as they are easily removable. Peelable solder masks are for screen printing to areas of a completed printed board or panel before shipment, so as to protect areas of the board or panel during processes by the board assembler. Mainly used for protection of keypad contacts during fluxing and mass soldering.

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    Document Type Standard
    Publisher German Institute for Standardisation (Deutsches Institut für Normung)
    Status Current
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