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  • BS EN 61249-8-8:1997

    Current The latest, up-to-date edition.

    Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  15-12-1997

    Publisher:  British Standards Institution

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    Abstract - (Show below) - (Hide below)

    Gives requirements for qualification of temporary solder resist coatings, known as masks as they are easily removable. Peelable solder masks are for screen printing to areas of a completed printed board or panel before shipment, so as to protect areas of the board or panel during processes by the board assembler. Mainly used for protection of keypad contacts during fluxing and mass soldering.

    General Product Information - (Show below) - (Hide below)

    Committee EPL/501
    Development Note Also numbered as IEC 61249-8-8 Supersedes 94/211487 DC (11/2005)
    Document Type Standard
    Publisher British Standards Institution
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS 6221-21:2001 Printed wiring boards Guide to the rework of unassembled boards

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60112:2003+AMD1:2009 CSV Method for the determination of the proof and the comparative tracking indices of solid insulating materials
    IEC 61252:1993+AMD1:2000+AMD2:2017 CSV Electroacoustics - Specifications for personal sound exposure meters
    HD 323.2.20 : 200S3 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
    IEC 60993:1989 Electrolyte for vented nickel-cadmium cells
    IEC 60695-2-1:1991 Fire hazard testing - Part 2: Test methods - Section 1: Glow-wire test and guidance
    IEC 60250:1969 Recommended methods for the determination of the permittivity and dielectric dissipation factor of electrical insulating materials at power, audio and radio frequencies including metre wavelengths
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    EN 62326-4-1:1997 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C
    IEC 60243:1967 Recommended methods of test for electric strength of solid insulating materials at power frequencies
    IEC 61189-1:1997+AMD1:2001 CSV Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
    EN 61189-3:2008 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    IEC 60068-2-3:1969 Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state
    IEC 61189-3:2007 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
    BS EN 60068-2-30:2005 Environmental testing Tests. Test Db and guidance: Damp heat, cyclic (12 h + 12 h cycle)
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    ISO 62:2008 Plastics Determination of water absorption
    IEC 60426:2007 Electrical insulating materials - Determination of electrolytic corrosion caused by insulating materials - Test methods
    IEC 62326-4-1:1996 Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C
    EN 61189-1 : 97 AMD 1 2001 TEST METHODS FOR ELECTRICAL MATERIALS, INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 1: GENERAL TEST METHODS AND METHODOLOGY
    IEC 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
    EN 61189-2:2006 Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
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