DOD-STD-2000-2 Revision A:1986
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
17-10-1994
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1 SCOPE
1.1 Applicability
2 REFERENCED DOCUMENTS
2.1 Government documents
2.1.1 Specifications, standards and handbooks
2.2 Other publications
3 DEFINITIONS
3.1 Terms and definitions
4 GENERAL REQUIREMENTS
4.1 Conflict
4.2 Design
4.2.1 Design requirements information
4.3 Solder processes and processing
4.4 Soldered connections
4.5 Hybrid microelectronic modules and assemblies
4.6 Electrostatic discharge
4.7 Component positioning
4.8 Visibility of markings
4.9 Part marking and reference designations
4.10 Interference spacing
4.11 Part clearance spacing
4.12 Piggybacking
4.13 Lead forming
4.13.1 Lead malforming limits
4.13.2 Tempered leads
4.14 Jumper wires
4.15 Insulation clearance
4.16 Eyelets
4.17 Resins and other adhesives
5 DETAIL REQUIREMENTS
5.1 Mounting of parts and components
5.1.1 Parts and components mounted to printed wiring
boards
5.1.2 Terminal board mountings
5.1.3 Mounting to terminals
6 NOTES
6.1 Supersession note
6.2 Changes from previous issue
6.3 Subject term (key word listing)
6.4 Use of metric units
INDEX
INDEX OF REFERENCED DOCUMENTS
Specifies mounting for electrical and electronic components and wiring in aircraft, guided missiles, satellites, ammunition and weapon systems, shipboard weapon systems, ground vehicle equipment, and program critical ground support equipment.
| Committee |
AREA SOLD
|
| DevelopmentNote |
A NOTICE 1 - Notice of Cancellation/Superseded by MIL STD 2000 (11/2003)
|
| DocumentType |
Standard
|
| Pages |
76
|
| PublisherName |
US Military Specs/Standards/Handbooks
|
| Status |
Superseded
|
| SupersededBy |
| DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
| DOD STD 2000/3 : A NOTICE 1 | CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY |
| MIL-C-28809 Revision B:1988 | CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX |
| MIL-STD-1547 Revision B:1992 | ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES |
| DOD STD 2000/3 : A NOTICE 1 | CRITERIA FOR HIGH QUALITY/HIGH RELIABILITY SOLDERING TECHNOLOGY |
| MIL-STD-2118 Base Document:1984 | FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| MIL C 55365/4 : D | CAPACITORS, CHIP, FIXED, TANTALUM, ESTABLISHED RELIABILITY, STYLES CWR06 AND CWR09 |
| MIL-STD-275 Revision E:1984 | PRINTED WIRING - ELECTRONIC EQUIPMENT |
| DOD STD 1686 : 0 | ELECTROSTATIC DISCHARGE CONTROL PROGRAM FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)(METRIC) |
| DOD-STD-2000-1 Revision B:1986 | SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY |
| MIL-M-38510 Revision J:1991 | MICROCIRCUITS, SPECIFICATION FOR |
| MS21266 Revision E:1981 | GROMMET PLASTIC EDGING |
| DOD HDBK 263 : LATEST | ELECTROSTATIC DISCHARGE CONTROL HANDBOOK FOR PROTECTION OF ELECTRICAL AND ELECTRONIC PARTS, ASSEMBLIES AND EQUIPMENT (EXCLUDING ELECTRICALLY INITIATED EXPLOSIVE DEVICES)METRIC |
| MIL-STD-1389 Revision D:1989 | DESIGN REQUIREMENTS FOR STANDARD ELECTRONIC MODULES |
| MIL R 55342 : C | RESISTORS, FIXED, FILM, CHIP, ESTABLISHED RELIABILITY, GENERAL SPECIFICATION FOR |
| MIL P 50884 : E | PRINTED WIRING BOARD, FLEXIBLE OR RIGID-FLEX, GENERAL SPECIFICATION FOR |
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