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  • MIL-STD-2118 Base Document:1984

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    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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    FLEXIBLE AND RIGID FLEX PRINTED WIRING FOR ELECTRONIC EQUIPMENT DESIGN REQUIREMENTS FOR

    Available format(s):  PDF

    Superseded date:  27-08-1999

    Language(s): 

    Published date: 

    Publisher:  US Military Specs/Standards/Handbooks

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    Abstract - (Show below) - (Hide below)

    Criteria governing flexible and rigid to flexible and design considerations for mounting parts and assemblies upon them.

    General Product Information - (Show below) - (Hide below)

    Committee FSC 4730
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Superseded
    Superseded By

    Standards Referenced By This Book - (Show below) - (Hide below)

    DOD-STD-2000-1 Revision B:1986 SOLDERING TECHNOLOGY, HIGH QUALITY/HIGH RELIABILITY
    DOD-STD-2000-4 Revision A:1987 GENERAL PURPOSE SOLDERING REQUIREMENT FOR ELECTRICAL AND ELECTRONIC EQUIPMENT
    MIL-C-28809 Revision B:1988 CIRCUIT CARD ASSEMBLIES, RIGID, FLEXIBLE & RIGID FLEX
    MIL-STD-2000 Revision A:1991 STANDARD REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    DOD-STD-2000-2 Revision A:1986 PART AND COMPONENT MOUNTING FOR HIGH QUALITY/HIGH RELIABILITY SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    MIL-STD-100 Revision G:1997 ENGINEERING DRAWINGS
    ASTM F 683 : 2014 : REDLINE Standard Practice for Selection and Application of Thermal Insulation for Piping and Machinery
    MIL-STD-1861 Revision A:1993 ELECTRICAL & ELECTRONIC ASSEMBLIES, BOARDS, CARDS, AND ASSOCIATED HARDWARE, SELECTION AND USE OF
    MIL-STD-1547 Revision B:1992 ELECTRONIC PARTS, MATERIALS, AND PROCESSES FOR SPACE VEHICLES

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC S 815 : B1987 GENERAL REQUIREMENTS FOR SOLDERING OF ELECTRONIC INTERCONNECTIONS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    MIL-STD-130 Revision N:2007 IDENTIFICATION MARKING OF U.S. MILITARY PROPERTY
    DOD STD 100 : C NOTICE 6 ENGINEERING DRAWING PRACTICES
    MIL-I-46058 Revision C:1972 Insulating Compound, Electrical (for Coating Printed Circuit Assemblies)
    QQ-C-576 Revision B:1961 COPPER FLAT PRODUCTS WITH SLIT, SLIT AND EDGE-ROLLED, SHEARED, SAWED OR MACHINED EDGES, (PLATE, BAR, SHEET, AND STRIP)
    IPC SM 840 : E QUALIFICATION AND PERFORMANCE SPECIFICATION OF PERMANENT SOLDER MASK AND FLEXIBLE COVER MATERIALS
    IPC FC 232 : C1994 AMD 1 1995 ADHESIVE COATED DIELECTRIC FILMS FOR USE AS COVER SHEETS FOR FLEXIBLE PRINTED WIRING AND FLEXIBLE BONDING FILMS
    IPC FC 231 : C1992 AMD 1 1995 FLEXIBLE BARE DIELECTRICS FOR USE IN FLEXIBLE PRINTED WIRING
    MIL G 45204 : C GOLD PLATING, ELECTRODEPOSITED
    QQ-S-571 Revision F:1994 SOLDER, ELECTRONIC (96 TO 485 DEGREES C)
    MIL-C-14550 Revision B:1983 COPPER PLATING (ELECTRODEPOSITED)
    MIL-P-81728 Revision A:1973 PLATING, TIN LEAD, (ELECTRODEPOSITED)
    IPC D 350 : 0 PRINTED BOARD DESCRIPTION IN DIGITAL FORM
    IPC FC 241 : C1992 AMD 1 1995 FLEXIBLE METAL CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED WIRING
    QQ-W-343 Revision G:1997 WIRE, ELECTRICAL, COPPER (UNINSULATED)
    MIL P 28809 : A PRINTED WIRING ASSEMBLIES
    QQ-N-290 Revision A:1971 NICKEL PLATING (ELECTRODEPOSITED)
    IPC FC 150 : E COPPER FOIL FOR PRINTED WIRING APPLICATIONS
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