DS/EN IEC 60749-37:2022
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Semiconductor devices – Mechanical and climatic test methods – Part 37: Board level drop test method using an accelerometer
Published date
28-11-2022
Publisher
This part of IEC 60749 provides a test method that is intended to evaluate and compare drop performance of surface mount electronic components for handheld electronic product applications in an accelerated test environment, where excessive flexure of a circuit board causes product failure.
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