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  • DS/EN IEC 61190-1-3:2018

    Current The latest, up-to-date edition.

    Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

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    Published date:  15-03-2018

    Publisher:  Danish Standards

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    IEC 61190-1-3:2017 prescribes the requirements and test methods for electronic grade solder alloys, for fluxed and non-fluxed bar, ribbon, powder solders and solder paste, for electronic soldering applications and for "special" electronic grade solders. For the generic specifications of solder alloys and fluxes, see ISO 9453.

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    Committee DS/V-001
    Document Type Standard
    Publisher Danish Standards
    Status Current
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