DSCC 10012 : 0
Current
Current
The latest, up-to-date edition.
PRINTED WIRING BOARD, RIGID, MULTILAYERED, GENERAL DRAWING
Published date
29-02-2012
Publisher
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1. SCOPE
2. APPLICABLE DOCUMENTS
3. REQUIREMENTS
4. VERIFICATION
5. PACKAGING
6. NOTES
Specifies the requirements for a family of rigid multilayered printed wiring boards that contain plated through holes.
| Committee |
FSC 5998
|
| DocumentType |
Standard
|
| PublisherName |
Defense Supply Centre Columbus
|
| Status |
Current
|
| DSCC 10013 : 0 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 3 WITH PLATED-THROUGH HOLES |
| DSCC 10014:2012 | PRINTED WIRING BOARD, RIGID, MULTILAYERED, TYPE 4 WITH BLIND AND BURIED VIAS |
| MIL-PRF-81705 Revision E:2009 | Barrier Materials, Flexible, Electrostatic Discharge Protective, Heat-Sealable |
| MIL-STD-130 Revision N:2007 | Identification Marking of U.S. Military Property |
| MIL-D-3464 Revision E:1987 | Desiccants, Activated, Bagged, Packaging Use and Static Dehumidification |
| MIL-DTL-45204 Revision D:2007 | Gold Plating, Electrodeposited |
| MIL-PRF-55110 Revision H:2014 | Printed Wiring Board, Rigid, General Specification for |
| SAE AMSQQN290C | Nickel Plating (Electrodeposited) |
| ASTM B 545 : 2013 : REDLINE | Standard Specification for Electrodeposited Coatings of Tin |
| SAE AMS2418J | Plating, Copper |
| MIL-PRF-22191 Revision F:2008 | Barrier Materials, Transparent, Flexible, Heat-Sealable |
| SAE AMS2403M | Plating, Nickel General Purpose |
| SAE AMSP81728B | Plating, Tin-Lead (Electrodeposited) |
| ASTM D 1867 : 2013 : REDLINE | Standard Specification for Copper-Clad Thermosetting Laminates for Printed Wiring |
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