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  • MIL-PRF-55110 Revision H:2014

    Current The latest, up-to-date edition.

    Printed Wiring Board, Rigid, General Specification for

    Available format(s):  PDF

    Language(s): 

    Published date:  15-09-2014

    Publisher:  US Military Specs/Standards/Handbooks

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    Table of Contents - (Show below) - (Hide below)

    1. SCOPE
    2. APPLICABLE DOCUMENTS
    3. REQUIREMENTS
    4. VERIFICATION
    5. PACKAGING
    6. NOTES
    APPENDIX A - PRODUCT ASSURANCE REQUIREMENTS FOR
                 QUALIFIED PRODUCTS LIST LEVEL
    APPENDIX B - PRODUCT ASSURANCE REQUIREMENTS FOR
                 QUALIFIED MANUFACTURER LIST LEVEL
    APPENDIX C - C = 0 SAMPLING, TEST EQUIPMENT, AND
                 INSPECTION FACILITIES
    APPENDIX D - SUPERSESSION, CONFORMANCE INSPECTION
                 OPTIONS, AND USE OF LEGACY DESIGN STANDARDS
    APPENDIX E - QUALIFICATION REQUIREMENTS FOR ALL LEVELS
                 OF PRODUCT ASSURANCE
    APPENDIX F - EXTERNAL VISUAL AND DIMENSIONAL ILLUSTRATIONS
    APPENDIX G - METALOGRPAHIC ILLUSTRATIONS
    APPENDIX H - QUALITY CONFORMANCE TEST CIRCUITRY

    Abstract - (Show below) - (Hide below)

    Sets up the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes.

    Scope - (Show below) - (Hide below)

    This specification establishes the performance and qualification requirements for rigid single-sided, double-sided, and multilayered printed wiring boards with or without plated through holes (see 6.1). Verification is accomplished through the use of MIL−PRF−31032 and its associated specification sheets. Detail requirements, specific characteristics, and other provisions which are sensitive to the particular intended use are specified in the applicable master drawing.

    General Product Information - (Show below) - (Hide below)

    Development Note Inactive for the new design. (12/2005)
    Document Type Standard
    Publisher US Military Specs/Standards/Handbooks
    Status Current
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    MIL-DTL-917 Revision F:2014 ELECTRIC POWER EQUIPMENT, BASIC REQUIREMENTS FOR
    BS IEC 63004:2015 Standard for receiver fixture interface
    IEC 63004:2015 Standard for receiver fixture interface
    JSSG-2010-12 Base Document:1998 Crew Systems Deployable Aerodynamic Decelerator (DAD) Systems Handbook
    MIL-PRF-55310 Revision E:2006 OSCILLATOR, CRYSTAL CONTROLLED, GENERAL SPECIFICATION FOR

    Standards Referencing This Book - (Show below) - (Hide below)

    IPC A 600 : H ACCEPTABILITY OF PRINTED BOARDS
    IPC T 50 : M TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS
    ISO/IEC 17025:2005 General requirements for the competence of testing and calibration laboratories
    MIL-PRF-31032-5 Revision B:2017 PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOPLASTIC, THERMOSETTING, OR THERMOPLASTIC AND THERMOSETTING RESIN BASE MATERIAL, WITH PLATED THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
    IPC 2220 : LATEST IPC 2220 FAMILY OF DESIGN DOCUMENTS
    IPC 9252 : A REQUIREMENTS FOR ELECTRICAL TESTING OF UNPOPULATED PRINTED BOARDS
    ANSI/NCSL Z540 3 : 2006(R2013) REQUIREMENTS FOR THE CALIBRATION OF MEASURING AND TEST EQUIPMENT
    ISO 14253-1:2017 Geometrical product specifications (GPS) — Inspection by measurement of workpieces and measuring equipment — Part 1: Decision rules for verifying conformity or nonconformity with specifications
    MIL-PRF-31032-6 Revision B:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE SIDED, THERMOPLASTIC RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR HIGH FREQUENCY APPLICATIONS
    ASME B89.7.3.2 : 2007 GUIDELINES FOR THE EVALUATION OF DIMENSIONAL MEASUREMENT UNCERTAINTY
    MIL-PRF-31032-1 Revision D:2017 PRINTED WIRING BOARD, RIGID, MULTILAYERED, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT BLIND AND BURIED PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
    IPC TM 650 : 0 TEST METHODS MANUAL
    MIL-PRF-31032 Revision C:2016 Printed Circuit Board/Printed Wiring Board, General Specification for
    ASTM B 567 : 1998 Standard Test Method for Measurement of Coating Thickness by the Beta Backscatter Method
    IPC 2221B:2012 GENERIC STANDARD ON PRINTED BOARD DESIGN
    ISO 10012:2003 Measurement management systems — Requirements for measurement processes and measuring equipment
    MIL-PRF-31032-2 Revision C:2017 PRINTED WIRING BOARD, RIGID, SINGLE AND DOUBLE LAYER, THERMOSETTING RESIN BASE MATERIAL, WITH OR WITHOUT PLATED-THROUGH HOLES, FOR SOLDERED PART MOUNTING
    IPC QL 653 : A Certification of Facilities that Inspect/Test Printed Boards, Components & Materials
    IPC OI 645 : 0 STANDARD FOR VISUAL OPTICAL INSPECTION AIDS
    ANSI/NCSL Z540 2 : 1997(R2012) U.S. GUIDE TO EXPRESSION OF UNCERTAINTY IN MEASUREMENT
    IPC 7095 : C DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS
    ISO/IEC Guide 98-3:2008 Uncertainty of measurement — Part 3: Guide to the expression of uncertainty in measurement (GUM:1995)
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