DSCC 21221A:2025
Current
Current
The latest, up-to-date edition.
MICROCIRCUIT, LINEAR, RADIATION HARDNESS ASSURED, SYNCHRONOUS BUCK CONVERTER, MONOLITHIC SILICON
Published date
02-12-2025
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This drawing documents product assurance class levels consisting of high reliability (device class Q), space
application (device class V or Y), and plastic encapsulated microcircuits (PEM) (device class N) for military, terrestrial and avionics application and device class P for space application.
| DocumentType |
Revision
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| PublisherName |
Defense Supply Centre Columbus
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| Status |
Current
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| Supersedes |
| JEDEC JEP157A:2022 | RECOMMENDED ESD-CDM TARGET LEVELS |
| MIL-STD-883 Revision K:2016 | Microcircuits |
| ASTM F 1192 : 2024 | Standard Guide for the Measurement of Single Event Phenomena (SEP) Induced by Heavy Ion Irradiation of Semiconductor Devices |
| JEDEC JEP155:2008 | RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION |
| JEDEC JESD 57A:2017 | TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION: |
| MIL-HDBK-780 Revision D:2004 | Standard Microcircuit Drawings |
| MIL-PRF-38535 Revision L:2018 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
| ANSI/ESDA/JEDEC JS-001:2023 | JOINT JEDEC/ESDA STANDARD FOR ELECTROSTATIC DISCHARGE SENSITIVITY TEST - HUMAN BODY MODEL (HBM) - COMPONENT LEVEL |
| JEDEC JEP163A:2022 | Selection of Burn-In/Life Test Conditions and Critical Parameters for QML Microcircuits |
| MIL-STD-1835 Revision D:2004 | Electronic Component Case Outlines |
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