EN 16602-70-28:2014

Foreword
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Requirements
Annex A (informative) - Removal of conformal coating
Annex B (informative) - Solder joint removal and unclinching
Annex C (informative) - Repair of damaged gold-plated
        areas
Annex D (informative) - Repair of damaged conductor tracks
Annex E (informative) - Repair of lifted conductors
Annex F (informative) - Repair of lifted terminal areas (pads)
Annex G (informative) - Terminal post replacement
Annex H (informative) - wire-to-wire joints
Annex I (informative) - Addition of components
Annex J (informative) - Removal and replacement of axial
        and multi-lead Components
Annex K (informative) - Removal and replacement of
        flat-pack Components
Annex L (informative) - Modification of component connections
Annex M (informative) - Cutting of internal track of a multi-layer
        printed circuit board
Bibliography

The requirements and procedures for repair and modification detailed in this Standard are designed to maintain the rigorous standards setby the customer for the manufacture and assembly of space-quality printed circuit boards.This Standard is confined to the repair and modification of single­sided, double­sided and multi­layer printed circuit board assemblies. This Standard does not address the potential need for rework resulting from a repair or modification and unassembled (bare) printedcircuits boards. This standard may be tailored for the specific characteristics and constraints of a space project, in conformance with ECSS-S-ST-00.