I.S. EN 16602-70-12:2016
Current
The latest, up-to-date edition.
SPACE PRODUCT ASSURANCE - DESIGN RULES FOR PRINTED CIRCUIT BOARDS
Hardcopy , PDF
English
01-01-2016
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
National Foreword
European foreword
Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
4 Principles
5 Design review and MRR
6 General design and production requirements
7 Rigid PCBs
8 Flex PCBs
9 Rigid-flex PCBs
10 Thermal rules and heat sinks
11 HDI PCBs
12 PCBs for high frequency applications
13 Electrical requirements for PCB design
14 Design for assembly
15 Design of test coupon
Annex A (normative) - PCB definition dossier - DRD
Annex B (normative) - PCB manufacturing dossier - DRD
Annex C (informative) - Example of capability list of PID
Annex D (informative) - Track current rating computation methodology
Annex E (informative) - Example of calculation of PTH pad dimensions
Annex F (informative) - Prevention of resin starvation and cracks
Annex G (informative) - Example of MRR checklist
Bibliography
Describes the requirements for the supplier and PCB manufacturer for PCB design.
| DocumentType |
Standard
|
| Pages |
176
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| DIN EN 16602-70-12:2016-12 | Equivalent |
| BS EN 16602-70-12:2016 | Equivalent |
| EN 16602-70-12:2016 | Identical |
| UNE-EN 16602-70-12:2016 | Equivalent |
| IPC T 50 : M | TERMS AND DEFINITIONS FOR INTERCONNECTING AND PACKAGING ELECTRONIC CIRCUITS |
| IPC 2315 : 0 | DESIGN GUIDE FOR HIGH DENSITY INTERCONNECTS AND MICROVIAS |
| EN 16602-70-10:2015 | Space product assurance - Qualification of printed circuit boards |
| IPC 2152 : 0 | STANDARD FOR DETERMINING CURRENT CARRYING CAPACITY IN PRINTED BOARD DESIGN |
| IPC 2226 : 0 | SECTIONAL DESIGN STANDARD FOR HIGH DENSITY INTERCONNECT (HDI) PRINTED BOARDS |
| IPC 2141 : A:2004 | DESIGN GUIDE FOR HIGH-SPEED CONTROLLED IMPEDANCE CIRCUIT BOARDS |
| IPC 2251 : 0 | DESIGN GUIDE FOR THE PACKAGING OF HIGH SPEED ELECTRONIC CIRCUITS |
| IPC 4101 : D | SPECIFICATION FOR BASE MATERIALS FOR RIGID AND MULTILAYER PRINTED BOARDS |
| IPC 7351 : B | GENERIC REQUIREMENTS FOR SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD |
| IPC 4104 : 1999 | SPECIFICATION FOR HIGH DENSITY INTERCONNECT (HDI) AND MICROVIA MATERIALS |
| IPC 2221B:2012 | GENERIC STANDARD ON PRINTED BOARD DESIGN |
| EN 16602-70-08:2015 | Space product assurance - Manual soldering of high-reliability electrical connections |
| IPC 2222 : A | SECTIONAL DESIGN STANDARD FOR RIGID ORGANIC PRINTED BOARDS |
| EN 16602-70-11:2015 | Space product assurance - Procurement of printed circuit boards |
| IPC 4204 : A | FLEXIBLE METAL-CLAD DIELECTRICS FOR USE IN FABRICATION OF FLEXIBLE PRINTED CIRCUITRY |
| EN 16602-70-28:2014 | Space product assurance - Repair and modification of printed circuit board assemblies for space use |
| IPC 4562 : A | METAL FOIL FOR PRINTED BOARD APPLICATIONS |
| IPC CF 152 : B | COMPOSITE METALLIC MATERIAL SPECIFICATION FOR PRINTED WIRING BOARDS |
| EN 16602-70-02:2014 | Space product assurance - Thermal vacuum outgassing test for the screening of space materials |
| IPC 2223 : C | SECTIONAL DESIGN STANDARD FOR FLEXIBLE/RIGID-FLEXIBLE PRINTED BOARDS |
| IPC 7095 : C | DESIGN AND ASSEMBLY PROCESS IMPLEMENTATION FOR BGAS |
| IPC 4121 : 0 | GUIDELINES FOR SELECTING CORE CONSTRUCTIONS FOR MULTILAYER PRINTED WIRING BOARD APPLICATIONS |
| EN 16603-20-06:2014 | Space engineering - Spacecraft charging |
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