EN 60068-2-82:2007

Superseded

Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Available format(s):

Superseded date: 11-07-2019

Language(s):

Published date: 22-06-2007

Publisher: European Committee for Standards - Electrical

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Table of Contents - (Show below) - (Hide below)

1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
  4.1 Desiccator
  4.2 Humidity chamber
  4.3 Thermal cycling chamber
  4.4 Optical microscope
  4.5 Scanning electron microscope microscopy
  4.6 Fixing jig
5 Preparation for test
  5.1 General
  5.2 Selection of test methods
  5.3 Storage conditions prior to testing
  5.4 Handling of the specimen
  5.5 Preconditioning by heat treatment
  5.6 Specimen preparation by leads forming
6 Test condition
  6.1 Ambient test
  6.2 Damp heat test
  6.3 Temperature cycling test
7 Test schedule
  7.1 Procedure for test method selection
  7.2 Initial measurement
  7.3 Test
  7.4 Recovery
  7.5 Intermediate or final assessment
8 Information to be given in the relevant specification
9 Minimum requirements for a test report
Annex A (normative) Measurement of the whisker length
Annex B (informative) Examples of whiskers
Annex C (informative) Guidance on the sample lots and test
                      schedules
Annex D (informative) Guidance on acceptance criteria
Annex E (informative) Background on whisker growth
Annex F (informative) Background on ambient test
Annex G (informative) Background on damp heat test
Annex H (informative) Background on temperature cycling test
Annex ZA (normative) Normative references to international
                      publications with their corresponding
                      European publications
Bibliography

Abstract - (Show below) - (Hide below)

IEC 60068-2-82:2007 specifies whisker tests for electric or electronic components representing the finished stage, with tin or tin-alloy finish. However, the standard does not specify tests for whiskers that may grow as a result of external mechanical stress. This test method is employed by a relevant specification (international component or application specification) with transfer of the test severities to be applied and with defined acceptance criteria. Where tests described in this standard are considered for other components, e.g. mechanical parts as used in electrical or electronic equipment, it should be ensured that the material system and whisker growth mechanisms are comparable.

General Product Information - (Show below) - (Hide below)

Committee	CLC/SR 91
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Superseded
Superseded By	EN IEC 60068-2-82:2019

National Adoptions - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
OVE/ONORM EN 60068-2-82 : 2008	Identical
UNE-EN 60068-2-82:2007	Identical
DIN EN 60068-2-82:2007-12	Identical
CEI EN 60068-2-82 : 2008	Identical
IEC 60068-2-82:2007	Identical
PN EN 60068-2-82 : 2008	Identical
BS EN 60068-2-82:2007	Identical
I.S. EN 60068-2-82:2007	Identical
NF EN 60068-2-82 : 2013	Identical
NBN EN 60068-2-82 : 2007	Identical
NEN EN IEC 60068-2-82 : 2007	Identical
BS EN 62231-1:2016	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 60384-1:2016	Fixed capacitors for use in electronic equipment Generic specification
BS EN 60115-1 : 2011	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
EN 61760-3:2010	Surface mounting technology - Part 3: Standard method for the specification of components for Through Hole Reflow (THR) soldering
BS EN 61760-3:2010	Surface mounting technology Standard method for the specification of components for through hole reflow (THR) soldering
BS EN 60512-16-21:2012	Connectors for electronic equipment. Tests and measurements Mechanical tests on contacts and terminations. Test 16u. Whisker test via the application of external mechanical stresses
I.S. EN 60115-1:2011	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION (IEC 60115-1:2008, MODIFIED)
I.S. EN 61760-3:2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
I.S. EN 60512-16-21:2012	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES (IEC 60512-16-21:2012 (EQV))
EN 60384-1:2016	Fixed capacitors for use in electronic equipment - Part 1: Generic specification
EN 60115-1:2011/A11:2015	FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 1: GENERIC SPECIFICATION
CEI EN 60512-16-21 : 2013	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES
CEI EN 61760-3 : 2010	SURFACE MOUNTING TECHNOLOGY - PART 3: STANDARD METHOD FOR THE SPECIFICATION OF COMPONENTS FOR THROUGH HOLE REFLOW (THR) SOLDERING
EN 60512-16-21:2012	CONNECTORS FOR ELECTRONIC EQUIPMENT - TESTS AND MEASUREMENTS - PART 16-21: MECHANICAL TESTS ON CONTACTS AND TERMINATIONS - TEST 16U: WHISKER TEST VIA THE APPLICATION OF EXTERNAL MECHANICAL STRESSES

Standards Referencing This Book - (Show below) - (Hide below)

IEC 61193-2:2007	Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
HD 323.2.20 : 200S3	BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST T - SOLDERING
IEC 60068-1:2013	Environmental testing - Part 1: General and guidance
IEC 60068-2-58:2015+AMD1:2017 CSV	Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
EN 60068-1:2014	Environmental testing - Part 1: General and guidance
IEC 61192-3:2002	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
EN 61760-1:2006	SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
IEC 61760-1:2006	Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
EN 61192-3:2003	Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
EN 60068-2-78:2013	Environmental testing - Part 2-78: Tests - Test Cab: Damp heat, steady state
IEC 60068-3-4:2001	Environmental testing - Part 3-4: Supporting documentation and guidance - Damp heat tests
IEC 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature
EN 60068-2-14:2009	Environmental testing - Part 2-14: Tests - Test N: Change of temperature

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