EN 60191-6-6:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)
04-07-2001
Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
3.1 Flanged type
3.2 Type of real chip size
3.3 FLGA
3.4 Material designation
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Provides common outline drawings and dimensions for all types of structures and composed materials of fine-pitch land grid whose terminal pitch is less than, or equal to, 0,80 mm and whose package body outline is square.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| SN EN 60191-6-6 : 2001 | Identical |
| NF EN 60191-6-6 : 2002 | Identical |
| UNE-EN 60191-6-6:2002 | Identical |
| IEC 60191-6-6:2001 | Identical |
| NEN EN IEC 60191-6-6 : 2001 | Identical |
| DIN EN 60191-6-6:2002-02 | Identical |
| PN EN 60191-6-6 : 2002 | Identical |
| NBN EN 60191 6-6 : 2002 | Identical |
| I.S. EN 60191-6-6:2001 | Identical |
| CEI EN 60191-6-6 : 2002 | Identical |
| BS EN 60191-6-6:2001 | Identical |
| BS EN 60745-2-16:2010 | Identical |
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