EN 60204-33:2011
Current
The latest, up-to-date edition.
Safety of machinery - Electrical equipment of machines - Part 33: Requirements for semiconductor fabrication equipment
04-03-2011
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 General requirements
5 Incoming supply conductor terminations and
devices for disconnecting and switching off
6 Protection against electric shock
7 Protection of equipment
8 Equipotential bonding
9 Control circuits, emergency off (EMO), and
protective interlock circuits
10 Operator interfaces
11 Controlgear: location, mounting, and enclosures
12 Conductors and cables
13 Wiring practices
14 Electric motors and associated equipment
15 Accessories and lighting
16 Marking, warning signs and reference designations
17 Technical documentation
18 Testing
Annex A (normative) - Basic protection (protection
against indirect contact) in TN-systems
Annex B (normative) - Protection against indirect contact
in TT-systems (Derived from IEC 60364-4-41:2005
and IEC 60364-6:2006)
Annex C (normative) - Conductor ampacity, and creepage
and clearance distances
Annex D (normative) - Standard test fingers
Annex E (informative) - Types of system earthing (Derived
from IEC 60364-1: 2005)
Bibliography
Annex ZA (normative) - Normative references to
international publications with their
corresponding European publications
Annex ZZ (informative) - Coverage of Essential Requirements
of EC Directives
IEC 60204-33:2009 applies to electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of semiconductors. It is applicable to the electrical equipment or parts of the electrical equipment that operate with nominal supply voltages not exceeding 1 000 V for alternating current (a.c.) and not exceeding 1 500 V for direct current (d.c.), and with nominal supply frequencies not exceeding 200 Hz. For higher voltages or frequencies, special requirements IEC 60204 applies to electrical and electronic equipment associated with semiconductor fabrication equipment for the manufacture, measurement, assembly, and test of semiconductors.
| Committee |
CLC/TC 44X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| NBN EN 60204-33 : 2011 | Identical |
| BS EN 60204-33:2011 | Identical |
| DIN EN 60204-33:2011-11 | Identical |
| IEC 60204-33:2009 | Identical |
| CEI EN 60204-33 : 2012 | Identical |
| I.S. EN 60204-33:2011 | Identical |
| VDE 0113-33:2011-11 | Identical |
| NEN EN IEC 60204-33 : 2011 | Identical |
| UNE-EN 60204-33:2011 | Identical |