Customer Support: +353 (0)1 857 6730

Corporate Website About Us
  • There are no items in your cart
Please enter a keyword to search
Advanced search
Home
CENELEC
EN 60249-2-10 : 1994 AMD 5 2000

EN 60249-2-10 : 1994 AMD 5 2000

Withdrawn

Withdrawn

A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.

BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 10: EPOXIDE NON-WOVEN/WOVEN GLASS REINFORCED COPPER-CLAD LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST)

Withdrawn date

01-02-2006

Published date

12-01-2013

Publisher

European Committee for Standards - Electrical

Foreword
Preface
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material
  after complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications
         quoted in this standard with the references of
         the relevant European publications

Provides requirements for properties of epoxide non woven/woven glass reinforced copper clad laminated sheet of defined flammability, in thickness of 0.7 mm up to 3.2 mm. Includes internal marking, electrical properties, non-electrical properties of the copper clad sheet, non-electrical properties of the base material after complete removal of the copper foil, packaging and marking, and acceptance testing.

Committee
SR 91
DevelopmentNote
Supersedes HD 313.2.10 (07/2005)
DocumentType
Standard
PublisherName
European Committee for Standards - Electrical
Status
Withdrawn

IEC 60249-3-3:1991 Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60249-3-1:1981 Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
EN 60249-1 : 1993 COR 1994 BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS

View more information
Sorry this product is not available in your region.

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.

Get in touch with us