EN 60249-2-11 : 1994 AMD 4 2000
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
BASE MATERIALS FOR PRINTED CIRCUITS - PART 2: SPECIFICATIONS - SPECIFICATION NO. 11: THIN EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE, FOR USE IN THE FABRICATION OF MULTILAYER PRINTED BOARDS
01-02-2006
12-01-2013
FOREWORD
PREFACE
1 Scope
2 Materials and construction
3 Internal marking
4 Electrical properties
5 Non-electrical properties of the copper-clad sheet
6 Non-electrical properties of the base material after
complete removal of the copper foil
7 Packaging and marking
8 Acceptance testing
Annex ZA (normative) Other international publications quoted in
this standard with the references
of the relevant European publications
Gives requirements for properties of thin epoxide woven glass fabric copper clad laminated sheet, general-purpose grade, for use in the fabrication of multilayer printed boards. Although intended for multilayer boards, the materials may be used for single sided or double-sided printed boards. Includes materials and construction, internal marking, electrical properties, non electrical properties of the copper clad sheet, non electrical properties of the base material after complete removal of the copper foil, packaging and marking and acceptance testing.
| Committee |
SR 91
|
| DevelopmentNote |
Supersedes HD 313.2.11. (07/2005)
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| IEC 60249-2-11:1987 | Identical |
| SN EN 60249-2-11 : 1994 AMD 4 2000 | Identical |
| PN EN 60249-2-11 : 2002 | Identical |
| DIN EN 60249-2-11:2001-09 | Identical |
| I.S. EN 60249-2-11:1995 | Identical |
| NBN EN 60249 2-11 : 96 AMD 1 2001 | Identical |
| NF EN 60249 2-11 : 96 AMD 4 2001 | Identical |
| BS EN 60249-2-11:1994 | Identical |
| NEN 10249-2-11 : 1994 AMD 3 1996 | Identical |
| NEN EN IEC 60249-2-11 : 1994 AMD 4 2001 | Identical |
| UNE-EN 60249-2-11/A4:2001 | Identical |
| UNE-EN 60249-2-11:1996 | Identical |
| IEC 60249-3-3:1991 | Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards |
| IEC 60249-3-1:1981 | Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards |
| EN 60249-1 : 1993 COR 1994 | BASE MATERIALS FOR PRINTED CIRCUITS - PART 1: TEST METHODS |
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