EN 60749-39:2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components
25-08-2006
28-01-2022
FOREWORD
1 Scope
2 Apparatus
3 Samples
4 Procedure
4.1 Sample preparation
4.2 Absorption measurements below 100 degree C
4.3 Solubility and diffusivity calculation
4.4 Desorption measurements above 100 degree C
5 Calculation of activation energy for moisture diffusion
6 Summary
Detailed the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components. These two material properties are important parameters for the effective reliability performance of plastic packaged semiconductors after exposure to moisture and being subjected to high-temperature solder reflow.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NBN EN 60749-39 : 2007 | Identical |
| BS EN 60749-39:2006 | Identical |
| CEI EN 60749-39 : 2007 | Identical |
| NEN EN IEC 60749-39 : 2007 | Identical |
| NF EN 60749-39 : 2006 | Identical |
| I.S. EN 60749-39:2006 | Identical |
| PN EN 60749-39 : 2008 | Identical |
| IEC 60749-39:2006 | Identical |
| DIN EN 60749-39:2007-01 | Identical |
| UNE-EN 60749-39:2006 | Identical |
| EN 60749-20-1:2009 | Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| BS EN 60749-20-1:2009 | Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| I.S. EN 60749-20-1:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
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