EN 60749-39 : 2006
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
View Superseded by
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 39: MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED FOR SEMICONDUCTOR COMPONENTS
28-01-2022
12-01-2013
FOREWORD
1 Scope
2 Apparatus
3 Samples
4 Procedure
4.1 Sample preparation
4.2 Absorption measurements below 100 degree C
4.3 Solubility and diffusivity calculation
4.4 Desorption measurements above 100 degree C
5 Calculation of activation energy for moisture diffusion
6 Summary
Describes the procedures for the measurement of the characteristic properties of moisture diffusivity and water solubility in organic materials used in the packaging of semiconductor components.
| Committee |
SR 47
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NBN EN 60749-39 : 2007 | Identical |
| BS EN 60749-39:2006 | Identical |
| CEI EN 60749-39 : 2007 | Identical |
| NEN EN IEC 60749-39 : 2007 | Identical |
| NF EN 60749-39 : 2006 | Identical |
| I.S. EN 60749-39:2006 | Identical |
| UNE-EN 60749-39:2006 | Identical |
| PN EN 60749-39 : 2008 | Identical |
| IEC 60749-39:2006 | Identical |
| DIN EN 60749-39:2007-01 | Identical |
| PNE-prEN 60749-39 | Identical |
| EN 60749-20-1 : 2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
| BS EN 60749-20-1:2009 | Semiconductor devices. Mechanical and climatic test methods Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat |
| I.S. EN 60749-20-1:2009 | SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 20-1: HANDLING, PACKING, LABELLING AND SHIPPING OF SURFACE-MOUNT DEVICES SENSITIVE TO THE COMBINED EFFECT OF MOISTURE AND SOLDERING HEAT |
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