EN 61188-5-3:2007
Current
The latest, up-to-date edition.
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
23-11-2007
FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
3.1 General component description
3.2 Marking
3.3 Carrier packaging format
3.4 Process considerations
4 TSOP (Type 1)
4.1 Field of application
4.2 Component description
4.3 Component dimensions
4.4 Solder joint fillet design
4.5 Land pattern dimensions
5 TSOP (Type 2)
5.1 Field of application
5.2 Component description
5.3 Component dimensions
5.4 Solder joint fillet design
5.5 Land pattern dimensions
6 SOP
6.1 Field of application
6.2 Component description
6.3 Component dimensions
6.4 Solder joint fillet design
6.5 Land pattern dimensions
7 SSOP
7.1 Field of application
7.2 Component description
7.3 Component dimensions
7.4 Solder joint fillet design
7.5 Land pattern dimensions
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Bibliography
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