IEC 61188-5-3:2007

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 TSOP (Type 1)
  4.1 Field of application
  4.2 Component description
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 TSOP (Type 2)
  5.1 Field of application
  5.2 Component description
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 SOP
  6.1 Field of application
  6.2 Component description
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 SSOP
  7.1 Field of application
  7.2 Component description
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
Bibliography

IEC 61188-5-3:2007 provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on two sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints. Each clause contains a specific set of criteria such that the information presented is consistent, providing information on the component, the component dimensions, the solder joint design, and the land pattern dimensions.

This publication is to be read in conjunction with IEC 61188-5-1 :2002.